Dr. Matthias Radecker
System design & integration departement, Fraunhofer Institute IZM
In the department of system design and integration, Dr. Matthias Radecker researches on electronic systems implementing state-of-the-art assembly and interconnect technologies. The chip to wafer processing is as important as small signal modelling for Dr. Radeckers applied research. The goal is to provide proven simulation and measurement techniques to accompany product development.
Networking and Security Expert
Philippe has more than 20 years of expertise in the Networking, Telecommunication, Storage and Cyber-security areas. He started his career at IBM Networking Hardware Division as telecom ASIC and board designer then moved to IBM Microelectronics division where he was in charge of handling the technical interface to large telecom accounts like Nortel and Newbridge. After spending two years at Mariner Networks, US based telecom equipment company as the Ethernet Solutions R&D Manager, he moved to EXAR Corporation, US based IC company, where he held several positions as EMEA & APAC Field Application Manager supporting large customers like Alcatel, Nokia, Siemens,... then as Telecom ICs System Architect and more recently as EMEA Technical Sales Manager for the Storage and Security ICs division.